平特五不中

L鈥橝telier scientifique sur les composants et microsyst猫mes: 茅volution des techniques de packaging et d鈥檌nterconnexion.

The ISS Program would like to announce a special 1-day workshop on Device Packaging to be presented Wednesday January 30, 2013 in collaboration with Le laboratoire Nanotechnologies Nanosyst猫mes (LN2), Le Centre de Collaboration MiQro Innovation (C2MI) and NanoQu茅bec.

鈥淟鈥橝telier scientifique sur les composants et microsyst猫mes: 茅volution des techniques de packaging et d鈥檌nterconnexion鈥� will be presented at the C2MI in Bromont, QC from 8:30 am to 6:00pm.

Registration and sign up for transport from 平特五不中 (downtown Montreal) to C2MI can be found at www.mcgill.ca/miam/iss/courses/packaging.聽 Space is limited; please sign up now to reserve your space.